Array Plates and Methods for Making and Using Same

ABSTRACT

A device includes a first structure with a sheet layer with a plurality of discrete through-holes and a second structure coupled to the first structure. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure. A top portion of the sheet layer, including the exposed portion of the first surface of the sheet layer, includes fluorocarbon. The second structure includes a material of a higher surface tension than the top of the sheet layer. A second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the second structure. The second structure extends at least partially into the plurality of discrete through-holes of the first structure.

RELATED APPLICATIONS

This application is a continuation-in-part application of PCT PatentApplication Serial No. PCT/IB2013/000623 filed on Feb. 5, 2013, whichclaims the benefit of and priority to U.S. provisional patentapplication No. 61/595,131, filed on Feb. 5, 2012 and U.S. provisionalpatent application No. 61/711,127, filed on Oct. 8, 2012, all of whichare hereby incorporated by reference in their entireties.

TECHNICAL FIELD

The disclosed embodiments relate generally to array plates and slides,and methods for making and using the same. More particularly, thedisclosed embodiments relate to array plates and slides for biologicaland/or chemical reactions, and methods for making and using the same.

BACKGROUND

An array plate is also called a microtiter plate, microplate, ormicrowell plate. Array plates are typically used to hold respectiveliquid droplets separately for biological and/or chemical reaction. Forexample, a well-type array plate includes a plurality of wells so thateach liquid droplet or each sample may be dispensed into a separate wellfor further processing. Typically, the number of wells is selected from6, 24, 96, 384, 1536, 3456, and 9600.

Polytetrafluoroethylene (PTFE) matrix-coated slides have been used forholding larger volumes of droplets on a microscope slide surface. ThePTFE matrix is patterned on a glass slide (e.g., a microscope slide) sothat the PTFE matrix covers portions of the glass microscope slide andthe remaining portions of the glass microscope slide are not covered bythe PTFE matrix. The PTFE matrix has hydrophobic characteristics and theportions of the glass microscope slide that are not covered by the PTFEmatrix have hydrophilic characteristics.

The PTFE matrix-coated slides are typically made by depositing a mixtureof resin and PTFE powder on glass slides. The resin in the PTFE matrixholds the PTFE powder together and also onto the glass slides.

However, the PTFE matrix has a lower hydrophobicity than pure PTFE,because the resin in the PTFE matrix has a lower hydrophobicity than thepure PTFE. When the PTFE matrix-coated slides are used inbiological/chemical processing, the PTFE matrix is easily contaminatedby biological and/or chemical materials used in the biological/chemicalprocessing. For example, proteins in biological samples may attach tothe PTFE matrix during biological assays. This leads to contamination ofsamples and inaccurate assay results.

SUMMARY

Accordingly, there is need for plates and slides with hydrophobicsurfaces with higher hydrophobicity. Such plates and slides may replacethe PTFE matrix-coated slides in performing biological and/or chemicalreactions. Such plates and slides reduce or eliminate adsorption ofbiological and/or chemical materials onto hydrophobic surfaces, therebyreducing contamination of samples and improving accuracy in assays.

A number of embodiments that overcome the limitations and disadvantagesof existing array plates and slides are presented in more detail below.These embodiments provide array plates and slides for biological and/orchemical reactions and methods for making and using the same.

As described in more detail below, some embodiments involve a method formanufacturing an array plate. The method includes providing a firststructure, the first structure including a sheet layer with a pluralityof discrete through holes. The method includes pressing the firststructure against a first surface of a mold, providing a heated plasticmaterial into the mold, and cooling the plastic material to form asecond structure so that the first structure and the second structureare coupled. The second structure includes a base layer and one or morevertical structures along a periphery of the base layer, adjacent afirst surface of the base layer. At least a portion of a first surfaceof the sheet layer of the first structure is exposed from the secondstructure, and a second surface of the sheet layer, opposite to thefirst surface of the sheet layer, is embedded in the base layer of thesecond structure adjacent the first surface of the base layer.

In accordance with some embodiments, an apparatus includes an arrayplate manufactured by the aforementioned method.

In accordance with some embodiments, an apparatus includes a firststructure, the first structure including a sheet layer with a pluralityof discrete through holes. The apparatus includes a second structurecoupled to the first structure, the second structure including a baselayer and one or more vertical structures along a periphery of the baselayer, adjacent a first surface of the base layer. At least a portion ofa first surface of the sheet layer of the first structure is exposedfrom the second structure, and a second surface of the sheet layer,opposite to the first surface of the sheet layer, is embedded in thebase layer of the second structure adjacent the first surface of thebase layer.

In accordance with some embodiments, a method includes providing anapparatus of the aforementioned apparatuses, the apparatus defining areservoir. The method includes storing a liquid medium in the reservoirof the apparatus so that the first surface of the sheet layer is coveredby the liquid medium, and dispensing respective liquid droplets onrespective locations on the base layer. The respective locationscorrespond to locations of the plurality of discrete through holesdefined in the sheet layer, and the respective liquid droplets areimmiscible with the liquid medium. In some embodiments, the methodincludes adding one or more solutions to one or more liquid droplets ofthe respective liquid droplets. In some embodiments, the method includesperforming an immunoassay by: immobilizing one of one or more antibodiesand one or more antigens in one or more respective liquid droplets tothe base layer; adding one or more solutions to the one or morerespective liquid droplets of the respective liquid droplets, at leastone of the one or more solutions including the other of the one or moreantibodies and the one or more antigens; and detecting a binding of theat least one antigen with at least one antibody in the one or morerespective liquid droplets. In some embodiments, the method includeswashing the respective liquid droplets on the apparatus by: removing aportion of the liquid medium; adding a wash buffer to the reservoir;shaking the apparatus so that the wash buffer and the respective liquiddroplets are mixed; draining at least a portion of the wash buffer fromthe reservoir; and providing a liquid medium in the reservoir of theapparatus so that the first surface of the sheet layer is covered by theliquid medium.

Some embodiments involve a method for manufacturing an array slide. Themethod includes providing a first structure in a mold. The firststructure includes a sheet layer with a plurality of discretethrough-holes. The method also includes providing a heated plasticmaterial into the mold and cooling the plastic material to form a secondstructure so that the first structure and the second structure arecoupled. At least a portion of a first surface of the sheet layer of thefirst structure is exposed from the second structure, and a secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the second structure.

Some embodiments involve an array slide manufactured by theaforementioned method.

In accordance with some embodiments, an array slide includes a firststructure including a sheet layer with a plurality of discretethrough-holes; and a second structure coupled to the first structure. Atleast a portion of a first surface of the sheet layer of the firststructure is exposed from the second structure. A top portion of thesheet layer, including the exposed portion of the first surface of thesheet layer, includes at least 95% of fluorocarbon by weight. A secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the second structure.

In accordance with some embodiments, a device includes a first structurewith a sheet layer with a plurality of discrete through-holes and asecond structure coupled to the first structure. At least a portion of afirst surface of the sheet layer of the first structure is exposed fromthe second structure. A top portion of the sheet layer, including theexposed portion of the first surface of the sheet layer, includesfluorocarbon. The second structure includes a material of a highersurface tension than the top of the sheet layer. A second surface of thesheet layer, opposite to the first surface of the sheet layer, isembedded in the second structure. The second structure extends at leastpartially into the plurality of discrete through-holes of the firststructure.

In accordance with some embodiments, a method includes providing a firststructure in a mold, the first structure including a sheet layer with aplurality of discrete through-holes and providing a heated plasticmaterial into the mold. The method also includes cooling the plasticmaterial to form a second structure so that the first structure and thesecond structure are coupled. At least a portion of a first surface ofthe sheet layer of the first structure is exposed from the secondstructure. A top portion of the sheet layer, including the exposedportion of the first surface of the sheet layer, includes fluorocarbon.The second structure includes a material of a higher surface tensionthan the top of the sheet layer. A second surface of the sheet layer,opposite to the first surface of the sheet layer, is embedded in thesecond structure. The second structure extends at least partially intothe plurality of discrete through-holes of the first structure.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the aforementioned embodiments as well asadditional embodiments, reference should be made to the Description ofEmbodiments below, in conjunction with the following drawings in whichlike reference numerals refer to corresponding parts throughout thefigures.

FIG. 1 is perspective views of an exemplary array plate in accordancewith some embodiments.

FIG. 2A is an exploded view of an exemplary combination of a firststructure and a second structure in accordance with some embodiments.

FIG. 2B is a perspective view of the exemplary combination of the firststructure and the second structure in accordance with some embodiments.

FIG. 2C is a cross-sectional view of the exemplary combination of thefirst structure and the second structure in accordance with someembodiments.

FIG. 2D is a partial sectional view of the exemplary combinationillustrated in FIG. 2C in accordance with some embodiments.

FIGS. 2E-2H are schematic diagrams illustrating selected steps formanufacturing an exemplary combination of a first structure and a secondstructure in accordance with some embodiments.

FIG. 3A is an exploded view of an exemplary array plate in accordancewith some embodiments.

FIGS. 3B, 3D, and 3F are top perspective views of an exemplary arrayplate in accordance with some embodiments.

FIG. 3C is a cross-sectional view of the exemplary array platecorresponding to a section indicated in FIG. 3B in accordance with someembodiments.

FIG. 3C-1 is a partial sectional view of the exemplary array platecorresponding to a portion of the cross-sectional view illustrated inFIG. 3C in accordance with some embodiments.

FIG. 3E is a cross-sectional view of the exemplary array platecorresponding to a section indicated in FIG. 3D in accordance with someembodiments.

FIG. 3E-1 is a partial sectional view of the exemplary array platecorresponding to a portion of the cross-sectional view illustrated inFIG. 3E in accordance with some embodiments.

FIG. 3G is a cross-sectional view of the exemplary array platecorresponding to a section indicated in FIG. 3F in accordance with someembodiments.

FIG. 3G-1 is a partial sectional view of the exemplary array platecorresponding to a portion of the cross-sectional view illustrated inFIG. 3G in accordance with some embodiments.

FIGS. 3H-3J are schematic diagrams illustrating selected steps formanufacturing an exemplary array plate in accordance with someembodiments.

FIG. 4A is a top perspective view of an exemplary array plate inaccordance with some embodiments.

FIG. 4B are partial top views of an exemplary array plate in accordancewith some embodiments.

FIGS. 5A-5C are partial sectional views of exemplary array plates inaccordance with various embodiments.

FIGS. 6A-6D are flow charts representing a method of making an arrayplate in accordance with some embodiments.

FIG. 7 is a perspective view of an exemplary array slide in accordancewith some embodiments.

FIG. 8A is a top-down view of an exemplary array slide in accordancewith some embodiments.

FIG. 8B is a partial cross-sectional view of an exemplary array slide inaccordance with some embodiments.

FIG. 8C is an exploded view of an exemplary array slide in accordancewith some embodiments.

FIGS. 9A-9D are schematic diagrams illustrating selected steps formanufacturing an exemplary array slide in accordance with someembodiments.

FIG. 10A is a top-down view of an exemplary array slide in accordancewith some embodiments.

FIG. 10B is a partial cross-sectional view of an exemplary array slidein accordance with some embodiments.

FIG. 10C is a top-down view of exemplary array slides in accordance withsome embodiments.

FIG. 11A is a top-down view of an exemplary array slide in accordancewith some embodiments.

FIG. 11B is a partial cross-sectional view of an exemplary array slidein accordance with some embodiments.

FIGS. 12A-12D are flow charts representing a method of making an arrayslide in accordance with some embodiments.

Like reference numerals refer to corresponding parts throughout thedrawings.

DESCRIPTION OF EMBODIMENTS

Array plates and slides and methods for making and using the arrayplates and slides are described. Reference will be made to certainembodiments, examples of which are illustrated in the accompanyingdrawings. While the claims will be described in conjunction with theembodiments, it will be understood that it is not intended to limit theclaims to these particular embodiments alone. On the contrary, theembodiments are intended to cover alternatives, modifications andequivalents that are within the spirit and scope of the appended claims.

Moreover, in the following description, numerous specific details areset forth to provide a thorough understanding of the embodiments.However, it will be apparent to one of ordinary skill in the art thatthe embodiments may be practiced without these particular details. Inother instances, methods, procedures, components, and networks that arewell-known to those of ordinary skill in the art are not described indetail to avoid obscuring aspects of the embodiments.

It will also be understood that, although the terms first, second, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first surface could be termed asecond surface, and, similarly, a second surface could be termed a firstsurface, without departing from the scope of the embodiments. The firstsurface and the second surface are both surfaces, but they are not thesame surface.

The terminology used in the description of the embodiments herein is forthe purpose of describing particular embodiments only and is notintended to be limiting of the invention. As used in the description ofthe embodiments and the appended claims, the singular forms “a,” “an,”and “the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. It will also be understood that theterm “and/or” as used herein refers to and encompasses any and allpossible combinations of one or more of the associated listed items. Itwill be further understood that the terms “comprises” and/or“comprising,” when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof

Array Plates and Methods for Making the Array Plates

FIG. 1 is perspective views of an exemplary array plate in accordancewith some embodiments. In particular, FIG. 1 includes a top perspectiveview 110-A, a front perspective view 110-B, a left perspective view110-C, a right perspective view 110-D, and oblique perspective views110-E and 110-F of an exemplary array plate 110.

The exemplary array plate 110 includes at least a combination of a firststructure (e.g., a plate) and a second structure (e.g., a frame). Thedetails of the first structure and the second structure are describedwith respect to FIGS. 2A-2G below.

FIG. 2A is an exploded view of an exemplary combination of a firststructure 202 and a second structure 204 in accordance with someembodiments. The first structure 202 includes a sheet layer thattypically has a square or rectangular planar shape. Alternatively, thesheet layer of the first structure 202 may have a round shape, such as acircle or an oval. Optionally, the first structure 202 may also includeadditional features, such as one or more vertical structures describedbelow (e.g., the first structure 202 may be a tray including the sheetlayer and one or more short sidewalls). In some embodiments, the sheetlayer of the first structure 202 includes a sheet of a preselectedmaterial of a predefined thickness. The preselected material includes apolymer (e.g., polytetrafluoroethylene, any other perfluorocarbonpolymer, or any other fluorocarbon polymer). The sheet layer has athickness typically of 0.01-10 mm, 0.1-2 mm, 0.2-1 mm, or 1-2 mm.

A plurality of discrete through holes 206 are defined in the sheet layerof the first structure 202. The plurality of discrete through holes 206are formed by punching holes through the sheet layer of the firststructure 202 (which typically includes a polymer). Typically, theplurality of discrete through holes have substantially the same diameter(e.g., with less than 50, 30, 20, 10, or 5% variation among the holes).In some embodiments, a respective through hole has a 1 mm-5 mm diameter,or 2 mm-3 mm diameter. In some embodiments, the discrete through holesare arranged in a predefined pattern. For example, when 96 discretethrough holes are defined in the sheet layer of the first structure 202,the 96 discrete through holes are arranged in an 8×12 array. In someembodiments, the discrete through holes have a predefined spacing.

In some embodiments, the sheet layer of the first structure 202 includesat least 50% of fluorocarbon by weight. Alternatively, the sheet layerof the first structure 202 may include at least 60, 70, 80, 90, 95, or99% of fluorocarbon by weight. In some embodiments, the sheet layer ofthe first structure 202 includes at least 90% of polytetrafluoroethyleneby weight. Alternatively, the sheet layer of the first structure 202 mayinclude at least 50, 60, 70, 80, 95, or 99% of polytetrafluoroethyleneby weight.

In some embodiments, a first surface (e.g., a surface facing away fromthe second structure 204) of the first structure 202 is roughened toincrease the hydrophobicity and/or oleophobicity.

In some embodiments, at least the first surface of the first structure202 is coated with a material of at least 50% of fluorocarbon by weight.The thickness of the coated material may be as thin as 1 nm, 2 nm, 5 nm,or 10 nm.

The second structure 204 includes a base layer 208 and one or morevertical structures 212 along, or adjacent to, a periphery of the baselayer 208, adjacent a first surface of the base layer 208 (e.g., a topsurface of the base layer 208 facing the first structure 202 asillustrated in FIG. 2A). As used herein, a vertical structure 212 refersto a structure protruding from a plane defined by the base layer 208.The vertical structure 212 typically defines a plane that issubstantially perpendicular to the plane defined by the base layer 208(e.g., the angle formed by the vertical structure 212 and the base layer208 is 45° or less). In some embodiments, the one or more verticalstructures 212 typically have at least 3 mm height. Alternatively, theone or more vertical structures 212 may have 1 mm, 2 mm, 4 mm, 5 mm, 6mm, 8 mm, 10 mm, 12 mm, 14 mm, or 15 mm height. In some embodiments, theone or more vertical structures 212 have 0.1-5 mm width. Alternatively,the one or more vertical structures 212 may have 1-4 mm, 1-3 mm, 2-4 mm,1-2 mm, or 2-3 mm width. In some embodiments, the one or more verticalstructures 212 are configured to form a reservoir with the base layer208. In other words, the reservoir is defined by the one or morevertical structures 212 and the base layer 208. In such embodiments, thereservoir formed by the one or more vertical structures of the secondstructure hold liquid without leaks. In some embodiments, the reservoirformed by the first structure and the second structure is configured tostore at least a predefined volume of liquid (e.g., 1 ml, 5 ml, 10 ml,20 ml, 50 ml, 100 ml, etc.).

In some embodiments, the base layer 208 of the second structure 204includes a plurality of structures 210 that correspond to the pluralityof discrete through holes in the first structure 202. In someembodiments, the second structure 204 is configured to mate with thefirst structure 202.

In some embodiments, the one or more vertical structures 212 include aplurality of pins 214. In some embodiments, the plurality of pins 214vertically protrudes from the rest of the one or more verticalstructures (e.g., a tip of a pin 214 is located further away from therest of the one or more vertical structures). In some embodiments, thepins 214 provide additional stiffness for the one or more verticalstructures 212. In some embodiments, the pins 214 also provideadditional stiffness for the one or more side walls formed over the oneor more vertical structures 212 so that the one or more side walls maymaintain a flat top surface. In some embodiments, the pins 214 are usedto remove an array plate from a mold, the process of which is describedbelow with respect to FIG. 3J.

The second structure 204 typically includes a plastic material. In someembodiments, the plastic material includes polycarbonates. In someembodiments, the plastic material includes cyclic olefin polymer orcopolymer.

In some embodiments, the plastic material of the second structure 204 isoptically transparent. This allows the second structure 204 to beoptically imaged from a bottom surface side of the base layer 208 facingaway from the first structure 202. In order to obtain high qualityimages, it is important to keep the first structure and the secondstructure.

FIG. 2B is a perspective view of the exemplary combination 220 of thefirst structure 202 and the second structure 204 in accordance with someembodiments.

In some embodiments, the combination 220 of the first structure 202 andthe second structure 204 is made by forming the second structure 204through a molding process while the first structure is placed in a mold.The details of the molding process are described with respect to FIGS.2E-2H below. Alternatively, the first structure 202 and the secondstructure 204 may be separately manufactured and subsequently attachedtogether. However, forming the second structure through the moldingprocess provides several advantages, including a better seal between thefirst structure and the second structure, the absence of glue oradhesives in forming the combination 220 of the first structure 202 andthe second structure 204, and also a reduced number of manufacturingsteps. The absence of glue or adhesives reduces the interference onbiological experiments on the plate.

FIG. 2B also indicates a line 2B-2B′ across the combination 220 of thefirst structure 202 and the second structure 204. The line 2B-2B′corresponds to the cross-sectional view illustrated in FIG. 2C.

FIG. 2C is a cross-sectional view of the exemplary combination 220 ofthe first structure 202 and the second structure 204 in accordance withsome embodiments. FIG. 2C also illustrates a pin 214 that verticallyprotrudes from the rest of the second structure 204 and a base layer208.

FIG. 2D is a partial sectional view of the exemplary combination 220illustrated in FIG. 2C, near the junction of the base layer 208 and theone or more vertical structures 212, in accordance with someembodiments. When the second structure 204 is formed by a moldingprocess, the base layer 208 and the one or more vertical structures 212are integrally formed so that there is no hole or gap through whichliquids leak.

As shown in FIG. 2D, in the combination 220 of the first structure 202and the second structure 204, at least a portion of a first surface ofthe sheet layer of the first structure 202 (e.g., a top surface of thesheet layer of the first structure 202 facing away from the secondstructure 204) is exposed from the second structure 204, and a secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, (e.g., a bottom surface of the sheet layer of the first structure202 facing the base layer 208 of the second structure 204) is embeddedin the base layer 208 of the second structure 204 adjacent the firstsurface of the base layer 208. In other words, the top surface of thesheet layer of the first structure 202 is not entirely covered by thesecond structure 204. However, in some embodiments, a portion of the topsurface of the sheet layer of the first structure 202 is covered by thesecond structure 204 along the periphery of the first structure. Thebottom surface of the sheet layer of the first structure 202 is incontact with the base layer 208 of the second structure 204.

In some embodiments, the first structure 202 and the second structure204 have a surface tension difference of more than 10 dynes/cm. In someembodiments, the second structure 204 is more hydrophilic than the firststructure 202, and the first structure 202 is more hydrophobic than thesecond structure 204.

FIGS. 2E-2H are schematic diagrams illustrating selected steps formanufacturing an exemplary combination 220 of a first structure 202 anda second structure 204 in accordance with some embodiments. The elementsin FIGS. 2E-2H are not drawn to scale.

FIG. 2E illustrates that the first structure 202 is held in a first moldcomponent 230 by vacuum suction. The vacuum suction pulls the firststructure 202 toward the first mold component 230 so that the firststructure 202 remains flat through the molding process. Typically, thevacuum suction is applied over a plurality of locations on the firststructure 202. The vacuum suction typically leaves one or moreindentations on the surface of the first structure 202 facing the firstmold component 230. In some embodiments, the first mold component 230includes a plurality of vacuum holes (not shown).

In some embodiments, a plurality of pins 242 coupled with the secondmold component 240 are spring loaded so that the plurality of pins 242are configured to apply force on the first structure 202 toward thefirst mold component 230 when the first mold component 230 and thesecond mold component 240 are assembled together.

In some embodiments, the bottom surface of the first structure 202(e.g., the surface facing the second mold component 240) is treated,typically before the first structure 202 is held in the first moldcomponent 230, to facilitate coupling with the second structure 204. Insome embodiments, the bottom surface of the first structure 202 istreated to reduce the hydrophobicity (e.g., increase the surfacetension) of the first structure 202. In some embodiments, the bottomsurface of the first structure 202 is roughened to increate the contactarea with the second structure 204.

In some embodiments, the first mold component 230 has a flat surface ora portion of the surface that is flat facing the first structure 202. Insome embodiments, the surface of the first mold component 230 hasprotrusions and/or indentations, the impact of which is described belowwith respect to FIGS. 5A-5C below.

FIG. 2F illustrates that the first mold component 230 and the secondmold component 240 are assembled, thereby forming a cavity inside, intowhich a heated plastic material is introduced for a molding process.

FIG. 2G illustrates that a heated plastic material is introduced intothe cavity. In some embodiments, the plastic material includespolycarbonates. In some embodiments, the plastic material includescyclic olefin polymer or copolymer.

Once the heated plastic material is cooled, the plastic material formsthe second structure 204. When the second structure 204 is formed, thesecond structure 204 is coupled with the first structure 202 so as toform the combination 220 of the first structure 202 and the secondstructure 204.

FIG. 2H illustrates that the combination 220 is removed from the firstmold component 230 and the second mold component 240.

Note that the combination 220 removed from the first mold component 230and the second mold component 240 has pin marks corresponding to theplurality of pins 242 coupled with the second mold component 240. Whenoptical measurements (e.g., collection of optical images or opticalsignals) are performed through respective portions of the secondstructure 204 corresponding to the plurality of discrete through holesdefined in the first structure 202, if the pin marks are located at therespective portions of the second structure 204 corresponding to theplurality of discrete through holes defined in the first structure 202,the pin marks interfere optical measurements. Thus, to avoid theinterference by the pin marks, the plurality of pins 242 are locatedoffset from the plurality of discrete through holes defined in the firststructure 202. Alternatively, the first structure 202 and the secondstructure 204 are aligned so that the plurality of discrete throughholes defined in the sheet layer of the first structure 202 is offsetfrom the plurality of holding locations in the second structure 204.

Although FIGS. 2E-2H illustrate forming the combination 220 of the firststructure 202 and the second structure 204 by a molding process, thecombination 220 of the first structure 202 and the second structure 204may be manufactured by attaching the first structure 202 to a preformedsecond structure 204.

FIG. 3A is an exploded view of an exemplary array plate 320 inaccordance with some embodiments. The exemplary array plate 320 includesa third structure 310 and the combination 220 of the first structure 202and the second structure 204 described above with respect to FIGS.2E-2H.

In some embodiments, the third structure 310 includes a plurality ofvertical indentations 314 along the outside of the third structure 310.In some embodiments, a respective side of the third structure 310defines a longitudinal axis, and respective vertical indentations 314located on the respective side of the third structure 310 aresubstantially perpendicular to the longitudinal axis formed by therespective side of the third structure 310 (e.g., a respective verticalindentation 314 forms 60-120° with the longitudinal axis of therespective portion of the third structure 310). In some embodiments, thevertical indentations 314 are substantially perpendicular to the planedefined by the base layer 208 of the second structure 202 of thecombination 220 (e.g., a respective vertical indentation 314 forms 45°or less with a surface normal of the base layer 208 of the secondstructure 202 of the combination 220). In some embodiments, theplurality of vertical indentations 314 reduces distortion of the thirdstructure 310, thereby maintaining a flatness of the top surface of thethird structure 310.

In some embodiments, the third structure 310 includes one or morehandles 312, each handle 312 including a plurality of fins.

FIGS. 3B, 3D, and 3F are top perspective views of an exemplary arrayplate in accordance with some embodiments.

FIG. 3B also indicates a line 3B-3B′ across the array plate 320. Theline 3B-3B′ traverses a plurality of the discrete through holes in thesheet layer of the first structure 202. The line 3B-3B′ corresponds tothe cross-sectional view illustrated in FIG. 3C.

FIG. 3C is a cross-sectional view of the exemplary array plate 320corresponding to a section indicated in FIG. 3B in accordance with someembodiments. FIG. 3C-1 is a partial sectional view of a side wall regionof the exemplary array plate 320 illustrated in FIG. 3C. FIGS. 3C and3C-1 show that, in some embodiments, at least a portion of the firststructure 202 is covered by the third structure 310 so that the firststructure 202 is securely coupled, and any leak or retention of a liquidsolution along the line between the first structure 202 and the thirdstructure 310.

FIG. 3D also indicates a line 3D-3D′ across the array plate 320. Theline 3D-3D′ corresponds to the cross-sectional view illustrated in FIG.3E. The line 3D-3D′ traverses the pins 314 in the vertical structures ofthe second structure 204. The line 3D-3D′ corresponds to thecross-sectional view illustrated in FIG. 3E.

FIG. 3E is a cross-sectional view of the exemplary array plate 320corresponding to a section indicated in FIG. 3D in accordance with someembodiments. FIG. 3E-1 is a partial sectional view of a side wall region(corresponding a circle illustrated in FIG. 3E) of the exemplary arrayplate 320 illustrated in FIG. 3E. As illustrated in FIG. 3E, in someembodiments, the pin 314 extends through the third structure 310 so thata top of the pin 314 is exposed.

FIG. 3F also indicates a line 3F-3F′ across the array plate 320. Theline 3F-3F′ corresponds to the cross-sectional view illustrated in FIG.3E. The line 3F-3F′ traverses vertical indentations 314 on the sidewalls. The line 3F-3F′ corresponds to the cross-sectional viewillustrated in FIG. 3G.

FIG. 3G is a cross-sectional view of the exemplary array platecorresponding to a section indicated in FIG. 3F in accordance with someembodiments. FIG. 3G-1 is a partial sectional view of a side wall region(corresponding to a circle illustrated in FIG. 3G) of the exemplaryarray plate 320 illustrated in FIG. 3G. In some embodiments, the one ormore side walls each have an inner surface, an outer surface, a bottomadjacent the sheet layer of the first structure 202, and a top surfaceopposite the bottom, and a respective side wall of the one or more sidewalls includes one or more lips 322 on the top surface, at least one ofthe one or more lips aligned with the inner surface of the respectiveside wall.

FIGS. 3H-3J are schematic diagrams illustrating selected steps formanufacturing an exemplary array plate with a second molding process inaccordance with some embodiments. The elements in FIGS. 3H-3J are notdrawn to scale.

FIG. 3H illustrates that the combination 220 of the first structure 202and the second structure 204 is located in a cavity formed by a thirdmold component 350 and a fourth mold component 360.

FIG. 3I illustrates that the cavity formed by the third mold component350 and the fourth mold component 360 is filled with a heated secondplastic material. In some embodiments, the second plastic material isdistinct from the plastic material used to form the second structure. Insome embodiments, the second plastic material is identical to theplastic material used to form the second structure. In some embodiments,the second plastic material has a glass transition temperature lowerthan the glass transition temperature of the plastic material used forthe second structure 204. This reduces the glass transition of theplastic material in the second structure 204 during the second moldingprocess so that the second structure 204 maintains its shape andflatness during the second molding process. Exemplary glass transitiontemperatures are ˜95° C. for polystyrene, ˜130° C. forpolyfluorotetraethylene, and 145-150° C. for polycarbonates. The glasstransition temperature of cyclic olefin copolymer may exceed 150° C. Insome embodiments, the melting temperature for the second plasticmaterial is typically not higher than 200° C.

Once the second plastic material is cooled, the third structure 310 isformed. The third structure 310 is coupled with the combination 220 ofthe first structure 202 and the second structure 204. In someembodiments, the third structure 310 covers at least the one or morevertical structures of the second structure 204. In some embodiments,the third structure 310, when included, covers at least a portion of aninner surface of respective vertical structures 204, thereby forming oneor more side walls. In other words, in such embodiments, the reservoirof the array plate 320 is defined by the third structure 310 on thesides, and the first structure 202 and the second structure 204 on thebottom. In some embodiments, a respective side wall of the one or moreside walls has 1-8 mm, 2-5 mm, 2-4 mm, 2-3 mm, or 3-4 mm width. In someembodiments, a respective side wall of the one or more side walls has1-10 mm, 2-9 mm, 3-8 mm, 4-7 mm, or 5-6 mm height.

In some embodiments, the one or more side walls each have an innersurface, an outer surface, a bottom adjacent the sheet layer of thefirst structure 202, and a top surface opposite the bottom, and arespective side wall of the one or more side walls includes one or morevertical indentations 314 (FIG. 3G) along the outer surface of therespective side wall.

In some embodiments, the one or more side walls are made of ahydrophobic material of a surface tension lower than 35 dynes/cm (e.g.,hydrocarbon polymer, polypropylene, polytetrafluoroethylene, and theirderivative, etc.). In some embodiments, the one or more side walls aremade of a hydrophobic material of a surface tension lower than 25dynes/cm.

In some embodiments, the one or more side walls each have an innersurface, an outer surface, a bottom adjacent the sheet layer of thefirst structure, and a top surface opposite the bottom, and the innersurface of a respective side wall of the one or more side walls iscoated to expose a hydrophobic surface of a surface tension lower than35 dynes/cm.

Array plates with the one or more side walls made with an elasticmaterial can better handle thermal stress. Thus, in some embodiments,the hardness of the second plastic material is Shore A hardness of 85 orless. In some embodiments, the hardness of the second plastic materialis Shore A hardness of 80 or less. In some embodiments, the hardness ofthe second plastic material is Shore A hardness of 75 or less. In someembodiments, the second plastic material has a tensile modulus of lessthan 2 GPa.

FIG. 3J illustrates that the array plate 320 is released from the thirdmold component 350 and the fourth mold component 360. In someembodiments, releasing the array plate 320 from the third mold component350 includes pushing the plurality of pins 214 of the second structure204. In some embodiments, the second structure 204 and the plurality ofpins 214 of the second structure 204 are made of a stiffer material(e.g., a material with a higher elastic modulus, such as a springconstant, Young's modulus, etc.) than the third structure 310.

Although FIGS. 3H-3J illustrate forming the array plate 320 by a moldingprocess, the array plate 320 may be manufactured by interposing thecombination 220 of the first structure 202 and the second structure 204between a top layer and a bottom layer, both of which are prefabricated,and attaching the top layer and the bottom layer to each other and/or tothe combination 220 of the first structure 202 and the second structure204.

Although FIGS. 2E-2H and FIGS. 3H-3J illustrate manufacturing anexemplary array plate using two-step molding processes, it is alsopossible to make an array plate with a single molding process.

In some embodiments, the one or more vertical structures formed duringthe first molding process may be configured to form one or more sidewalls, thereby eliminating the need for a second molding process to formone or more side walls over the one or more vertical structures.

Alternatively, in some embodiments, the first structure 202 includes oneor more vertical structures (e.g., the first structure 202 includes atray that has the sheet layer and one or more vertical structures, suchas short walls, along the periphery of the sheet layer). In suchembodiments, the molding step to form the vertical structures isskipped. In a molding step for forming one or more side walls, the firststructure 202 is placed inside a mold, and a heated plastic isintroduced to form one or more side walls over the one or more verticalstructures of the first structure.

FIG. 4A is a top perspective view of an exemplary array plate inaccordance with some embodiments. FIG. 4B are partial top views of anexemplary array plate, corresponding to regions indicated with circlesin FIG. 4A, in accordance with some embodiments.

When the inner side walls and the base layer form sharp corners (e.g.,the inner side walls and the base layer form 90 degree angle), the sharpcorners hold more residual wash solution due to increased surfaceinteraction, i.e. adhesion between the plastic surface and the solution.Therefore, in some embodiments, the contact lines between the inner sidewalls and the base layer of the second structure have a curvedtransition (e.g., rounded) as shown in FIG. 4. The rounded four cornersof the circumferential wall reduce residual solution after a washingprocess.

FIGS. 4A-4B illustrate that, in some embodiments, at least one side wallis tilted outward an angle of 2-20 degrees so that the top of the sidewall (e.g., the end of the side wall that is away from the base layer)is positioned outside the bottom of the side wall (e.g., the end of theside wall that is closer to the base layer). In some embodiments, allside walls are tilted by between 2-5 degrees.

FIGS. 5A-5C are partial sectional views of exemplary array plates inaccordance with various embodiments.

FIG. 5A illustrates that, in some embodiments, a top surface of thesheet layer of the first structure 202 is aligned with a top surface ofthe base layer 208 of the second structure 204. In some embodiments, thealignment of the top surface of the sheet layer of the first structure202 and the top surface of the base layer 208 of the second structure204 is achieved by using a mold component (e.g., the first moldcomponent 230, FIG. 2E) that has a flat surface at least over a portionof the surface facing the top surface of the first structure 202. Asshown in FIG. 2G, the heated plastic material fills up the plurality ofdiscrete through holes defined in the first structure 202 up to thesurface of the mold component 230 that faces the first structure 202,which is aligned with the top surface of the first structure 202.

In some embodiments, a mold surface that has indentations and/orprotrusions is used. When the mold surface facing the top surface of thefirst structure 202 has indentations at locations corresponding to theplurality of discrete through holes defined in the first structure 202,the heated plastic material, when introduced into the cavity formed bymold components, fills the indentations. As a result, the top surface ofthe second structure is located above the top surface of the firststructure as shown in FIG. 5B. Alternatively, when the mold surfacefacing the top surface of the first structure 202 has protrusions atlocations corresponding to the plurality of discrete through holesdefined in the first structure 202, the heated plastic material, whenintroduced into the cavity formed by mold components, underfills thediscrete through holes defined in the first structure 202. As a result,the top surface of the second structure is located below the top surfaceof the first structure as shown in FIG. 5C. In some embodiments, the topsurface of the second structure includes a plurality of concavesurfaces. In some embodiments, a mold surface that has both indentationsand protrusions is used. When the mold surface facing the top surface ofthe first structure 202 has indentations and protrusions at locationscorresponding to the plurality of discrete through holes defined in thefirst structure 202, complex structures can be formed at the locationscorresponding to the plurality of discrete through holes defined in thefirst structure 202.

FIGS. 6A-6D are flow charts representing a method 600 of making an arrayplate in accordance with some embodiments.

The method includes (602) providing a first structure. The firststructure includes a sheet layer with a plurality of discrete throughholes.

In some embodiments, the sheet layer includes (604) at least 50% offluorocarbon by weight.

In some embodiments, the sheet layer includes (606) at least 90% offluorocarbon by weight.

The method includes placing the first structure adjacent to a firstsurface of a mold. In some embodiments, the method includes (608)pressing the first structure against the first surface of the mold.

In some embodiments, includes placing the first structure adjacent tothe first surface of the mold includes placing the first structureadjacent to the first surface of the mold with a plurality of pins. Insome embodiments, pressing the first structure against the first surfaceof the mold includes pressing the first surface of the sheet layeragainst the first surface of the mold with a plurality of pins. In someembodiments, pressing the first structure against the first surface ofthe mold includes (610) pressing the first surface of the sheet layeragainst the first surface of the mold with a plurality of pins at leaston the second surface of the sheet layer.

In some embodiments, the method includes (612) providing vacuum suctionon the first surface of the sheet layer.

The method includes (614) providing a heated plastic material into themold.

In some embodiments, the plastic material includes (616) polycarbonates.

In some embodiments, the plastic material includes (618) cyclic olefinpolymer or copolymer.

The method includes cooling the plastic material to form a secondstructure. In some embodiments, the method includes (620, FIG. 6B)cooling the plastic material to form a second structure so that thefirst structure and the second structure are coupled. The secondstructure includes a base layer. In some embodiments, the secondstructure includes a base layer and one or more vertical structuresalong a periphery of the base layer, adjacent a first surface of thebase layer. At least a portion of a first surface of the sheet layer ofthe first structure is exposed from the second structure, and a secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the base layer of the second structure adjacentthe first surface of the base layer.

In some embodiments, the plastic material of the second structure is(622) optically transparent.

In some embodiments, the method includes (624) coupling a thirdstructure with at least the second structure over at least a portion ofthe one or more vertical structures, the third structure including oneor more side walls.

In some embodiments, the one or more vertical structures of the secondstructure include (626) a plurality of pins vertically protruding fromthe rest of the one or more vertical structures.

In some embodiments, the method includes (628) molding the thirdstructure over at least a portion of the one or more vertical structureswith a second mold so as to couple the second structure and the thirdstructure, and removing a combination of the second structure and thethird structure from the second mold by pushing respective locations onthe third structure that correspond to the plurality of pins of thesecond structure.

In some embodiments, the one or more side walls are (630) made of aplastic material that has a glass transition temperature lower than theglass transition temperature of (the material for) the second structure.

In some embodiments, the one or more vertical structures include (632)one or more side walls.

In some embodiments, the one or more side walls are (634, FIG. 6C) madeof a material that has Shore A hardness of 85 or less.

In some embodiments, the one or more side walls each have (636) an innersurface, an outer surface, a bottom adjacent the sheet layer of thefirst structure, and a top surface opposite the bottom, and a respectiveside wall of the one or more side walls includes one or more lips on thetop surface, at least one of the one or more lips aligned with the innersurface of the respective side wall.

In some embodiments, the one or more side walls each have (638) an innersurface, an outer surface, a bottom adjacent the sheet layer of thefirst structure, and a top surface opposite the bottom, and a respectiveside wall of the one or more side walls includes one or more verticalindentations along the outer surface of the respective side wall.

In some embodiments, the one or more side walls are (640) made of ahydrophobic material of a surface tension lower than 35 dynes/cm.

In some embodiments, the one or more side walls each have (642) an innersurface, an outer surface, a bottom adjacent the sheet layer of thefirst structure, and a top surface opposite the bottom, and the innersurface of a respective side wall of the one or more side walls iscoated to expose a hydrophobic surface of a surface tension lower than35 dynes/cm.

In some embodiments, the second structure includes (644) a plurality ofholding locations, the method comprising aligning the first structureand the second structure so that the plurality of discrete through holesdefined in the sheet layer of the first structure is offset from theplurality of holding locations in the second structure.

In some embodiments, the mold is configured (646, FIG. 6D) so that a topsurface of the sheet layer of the first structure is aligned with a topsurface of the base layer of the second structure.

In some embodiments, the mold is configured (648) so that a top surfaceof the sheet layer of the first structure is above a top surface of thebase layer of the second structure.

In some embodiments, the mold is configured (650) so that a top surfaceof the sheet layer of the first structure is below a top surface of thebase layer of the second structure.

In some embodiments, the first surface of the mold has (652) one or moreof: a plurality of indentations and a plurality of protrusionscorresponding to the plurality of discrete through holes defined in thesheet layer.

In some embodiments, at least one of the side walls includes (654) oneor more handles, each handle comprising a plurality of parallel fins.

Many modifications and variations are possible in view of the aboveteachings. For example, in accordance with some embodiments, a methodfor making an array plate includes providing a first structure. Thefirst structure including a sheet layer with a plurality of discretethrough holes. The method includes pressing the first structure againsta first surface of a mold, and providing a heated plastic material intothe mold. The method includes cooling the plastic material to form asecond structure so that the first structure and the second structureare coupled. The second structure includes a base layer and one or moreside walls along a periphery of the base layer, adjacent a first surfaceof the base layer. At least a portion of a first surface of the sheetlayer of the first structure is exposed from the third structure, and asecond surface of the sheet layer, opposite to the first surface of thesheet layer, is embedded in the base layer of the second structureadjacent the first surface of the base layer.

In some embodiments, an array plate includes a first structure. Thefirst structure including a sheet layer with a plurality of discretethrough holes. The array plate also includes a second structure coupledto the first structure. The second structure including a base layer andone or more side walls along a periphery of the base layer, adjacent afirst surface of the base layer. At least a portion of a first surfaceof the sheet layer of the first structure is exposed from the secondstructure, and a second surface of the sheet layer, opposite to thefirst surface of the sheet layer, is embedded in the base layer of thesecond structure adjacent the first surface of the base layer.

In accordance with some embodiments, a method for making an array plateincludes providing a first structure. The first structure includes asheet layer with a plurality of discrete through holes. The firststructure also includes one or more vertical structures along aperiphery of the sheet layer. The method includes pressing the firststructure against a first surface of a mold, and providing a heatedplastic material into the mold. The method includes cooling the plasticmaterial to form a second structure so that the first structure and thesecond structure are coupled. The second structure includes a base layerand one or more side walls formed over the one or more verticalstructures. At least a portion of a first surface of the sheet layer ofthe first structure is exposed from the third structure, and a secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the base layer of the second structure adjacentthe first surface of the base layer.

In some embodiments, an array plate includes a first structure. Thefirst structure including a sheet layer with a plurality of discretethrough holes. The first structure also includes one or more verticalstructures along a periphery of the sheet layer. The array plate alsoincludes a second structure coupled to the first structure. The secondstructure including a base layer and one or more side walls formed overthe one or more vertical structures. At least a portion of a firstsurface of the sheet layer of the first structure is exposed from thesecond structure, and a second surface of the sheet layer, opposite tothe first surface of the sheet layer, is embedded in the base layer ofthe second structure adjacent the first surface of the base layer.

Operations and characteristics described above with respect to themethod 600 are also applicable to these methods and apparatuses. Forbrevity, such operations and characteristics are not repeated herein.

Methods for Using the Array Plates

In some embodiments, a method for using an array plate includesproviding the array plate, wherein the array plate defines a reservoir.The method includes storing a liquid medium in the reservoir of theapparatus so that the first surface of the sheet layer is covered by theliquid medium, and dispensing respective liquid droplets on respectivelocations on the base layer. The respective locations correspond tolocations of the plurality of discrete through holes defined in thesheet layer, and the respective liquid droplets are immiscible with theliquid medium.

In some embodiments, the method also includes adding one or moresolutions to one or more liquid droplets of the respective liquiddroplets.

In some embodiments, the method also includes performing an immunoassayby: immobilizing one of one or more antibodies and one or more antigensin one or more respective liquid droplets to the base layer, and addingone or more solutions to the one or more respective liquid droplets ofthe respective liquid droplets. At least one of the one or moresolutions includes the other of the one or more antibodies and the oneor more antigens. The method also includes detecting a binding of the atleast one antigen with at least one antibody in the one or morerespective liquid droplets.

In some embodiments, the method includes washing the respective liquiddroplets on the apparatus by: removing a portion of the liquid medium,adding a wash buffer to the reservoir, shaking the apparatus so that thewash buffer and the respective liquid droplets are mixed, draining atleast a portion of the wash buffer from the reservoir, and providing aliquid medium in the reservoir of the apparatus so that the firstsurface of the sheet layer is covered by the liquid medium.

Array Slides

FIG. 7 is a perspective view of an exemplary array slide 1100 inaccordance with some embodiments. The exemplary array slide 1100includes at least a first structure 1110 (e.g., a sheet layer) and asecond structure 1120 (e.g., a slide). The first structure 1110 includesfluorocarbon polymers. The first structure 1110 defines a plurality ofdiscrete through-holes (e.g., 1112-1 through 1112-8). The secondstructure 1120 includes a plastic material (e.g., polycarbonate, cyclicolefin polymer or copolymer, polystyrene, etc.). The first structure1110 covers one or more portions of the second structure 1120. One ormore portions of the second structure 1120 are not covered by the firststructure 1110. Thus, one or more portions of the second structure 1120are exposed through the plurality of discrete through-holes 1112 definedby the first structure 1110. The details of the first structure and thesecond structure are described with respect to FIGS. 8A-8C, 10A-10C, and11A-11B, below.

FIG. 8A is a top-down view of an exemplary array slide 1200 inaccordance with some embodiments. The array slide 1200 includes a firststructure 1210 and a second structure 1220. In some embodiments, thefirst structure 1210 has one or more characteristics of the firststructure 1110 described above with respect to FIG. 7. In someembodiments, the second structure 1220 has one or more characteristicsof the second structure 1120 described above with respect to FIG. 7. Thedescriptions of such characteristics are not repeated for brevity.

The first structure 1210 includes a sheet layer 1212 that typically hasa square or rectangular shape (e.g., a sheet of PTFE cut into arectangle). Alternatively, the sheet layer of the first structure 1210may have a round shape, such as a disc, or any other shape (e.g., agenerally rectangular shape with one or more chamfered corners).

The sheet layer 1212 defines a plurality of discrete through-holes(e.g., 1214-1 through 1214-8). Typically, a discrete through-hole 1214has a round shape (e.g., a circle or an oval). Alternatively, thediscrete through-hole 1214 may have a non-round shape (e.g., a triangle,a square, a rectangle, a pentagon, a hexagon, an octagon, a star, aslit, etc.). In some embodiments, the plurality of discretethrough-holes 206 are formed by punching holes through the sheet layer1212. Typically, the plurality of discrete through-holes havesubstantially the same diameter (e.g., with less than 50, 30, 20, 10, or5% variation among the holes). In some embodiments, a respectivethrough-hole has a 1 mm-5 mm diameter, or 2 mm-3 mm diameter. In someembodiments, the discrete through-holes are arranged in a predefinedpattern. For example, when 96 discrete through-holes are defined in thesheet layer 1212, the 96 discrete through-holes may be arranged in an8×12 array. In another example, when 8 discrete through-holes arearranged in the sheet layer 1212, the 8 discrete through-holes may bearranged in a 2×4 array, as illustrated in FIG. 8A. In some embodiments,the discrete through-holes have a predefined spacing.

The second structure 1220 typically has a rectangular shape. Forexample, the second structure 1220 may have a shape and size of amicroscope slide. However, the second structure 1220 may have a largeror smaller size than a microscope slide. In some embodiments, the secondstructure 1220 has a square shape. In some embodiments, the secondstructure 1220 has a non-rectangular shape (e.g., a disc or a generallyrectangular shape with one or more chamfered corners).

FIG. 8A also indicates a line A-A′ across the array slide 1200. The lineA-A′ corresponds to the cross-sectional view illustrated in FIG. 8B.

FIG. 8B is a partial cross-sectional view of the exemplary array slide1200 in accordance with some embodiments.

In some embodiments, the sheet layer 1212 solely constitutes the firststructure 1210. In some other embodiments, the first structure 1210includes additional features, such as one or more vertical structures(e.g., the first structure 1210 may be a tray including the sheet layerand one or more sidewalls) in addition to the sheet layer 1212.

In some embodiments, the sheet layer 1212 of the first structure 1210has a uniform thickness across the sheet layer 1212. In some otherembodiments, the sheet layer 1212 has a range of thicknesses across thesheet layer 1212. Typically, the thickness of the sheet layer 1212 isless than the width and length of the sheet layer 1212. In someembodiments, the thickness of the sheet layer 1212 is less than apredefined thickness. For example, the sheet layer has a thicknesstypically of 0.01-10 mm, 0.1-2 mm, 0.2-1 mm, or 1-2 mm.

In some embodiments, the sheet layer 1212 is a sheet of a preselectedmaterial. The preselected material typically includes a polymer (e.g.,polytetrafluoroethylene, any other perfluorocarbon polymer, or any otherfluorocarbon polymer). In some embodiments, the sheet layer 1212includes a sheet of a preselected material. For example, the sheet layer1212 may include multiple layers of different materials, wherein one ofthe multiple layers (e.g., typically a top layer) is a sheet offluorocarbon (e.g., polytetrafluoroethylene). Alternatively, the sheetlayer 1212 may include a core (e.g., a sheet metal) coated withfluorocarbon (e.g., polytetrafluoroethylene).

FIG. 8B also illustrates a cross-section of discrete through-holes1214-7 and 1214-8 defined by the sheet layer 1212. As shown in FIG. 8B,a discrete through-hole has a first opening on a first planar surface ofthe sheet layer 1212 and a second opening on a second planar surface,opposite to the first planar surface, of the sheet layer 1212.

In some embodiments, the sheet layer 1212 includes at least 50% offluorocarbon by weight. Alternatively, the sheet layer 1212 may includeat least 80, 90, 95, or 99% of fluorocarbon by weight. In someembodiments, the sheet layer 1212 includes at least 90% ofpolytetrafluoroethylene by weight. Alternatively, the sheet layer 1212may include at least 50, 80, 95, or 99% of polytetrafluoroethylene byweight.

In some embodiments, a top portion of the sheet layer 1212 includes atleast 95% of fluorocarbon by weight. As used herein, a top portion ofthe sheet layer 1212 refers to a layer that is defined by an exposedsurface of the sheet layer 1212 and a predefined thickness. Thus, thetop portion includes the exposed surface of the sheet layer 1212 and hasthe predefined thickness. In some embodiments, a top surface of the topportion is the exposed surface of the sheet layer 1212 and the bottomsurface of the top portion has the same shape and size as the topsurface of the top portion. In some embodiments, the exposed surface ofthe sheet layer 1212 has a flatness of at most 400 μm. In someembodiments, the bottom surface of the sheet layer 1212 has a flatnessof at most 400 μm. In some embodiments, the thickness of the top portionmay be 1 μm or 100 nm. In some embodiments, the top portion of the sheetlayer 1212 includes at least 99% of fluorocarbon by weight.

In some embodiments, at least 90% of the exposed portion of the firstsurface of the first structure 1210 (e.g., the surface of the sheetlayer 1212 that faces away from the second structure) is covered byfluorocarbon. In some embodiments, at least 95% of the exposed surfaceis covered by fluorocarbon. In some embodiments, at least 99% of theexposed portion of the first surface is covered by fluorocarbon. ThePTFE-matrix does not satisfy this requirement because the resin isincluded in the exposed portion of the first surface. In someembodiments, at least 90% of the exposed portion of the first surface iscovered by PTFE. In some embodiments, at least 95% of the exposedportion of the first surface is covered by PTFE. In some embodiments, atleast 99% of the exposed portion of the first surface is covered byPTFE.

In some embodiments, the exposed portion of the first surface ischaracterized by advancing and receding contact angles, for a liquidselected from a group including water, ethanol, and isopropanol. Theadvancing and receding contact angles for the selected liquid on theexposed portion of the first surface are substantially similar toadvancing and receding contact angles for the selected liquid on PTFE(e.g., a PTFE sheet containing at least 99% PTFE by weight). Forexample, the difference between the advancing contact angle for theselected liquid on the exposed portion of the first surface and theadvancing contact angle for the selected liquid on PTFE is less than 20%or 10% of the advancing and receding contact angles for the selectedliquid on PTFE.

In some embodiments, a first surface (e.g., a surface facing away fromthe second structure 1220) of the first structure 1210 is roughened toincrease the hydrophobicity and/or oleophobicity.

In some embodiments, the second structure 1220 includes a plurality ofstructures that correspond to the plurality of discrete through-holes inthe first structure 1210.

The second structure 1220 typically includes a plastic material. In someembodiments, the plastic material includes polycarbonates. In someembodiments, the plastic material includes cyclic olefin polymer orcopolymer or polystyrene.

In some embodiments, the plastic material of the second structure 1220is optically transparent. This allows the second structure 1220 to beoptically imaged from a bottom surface side of the second structure1220.

FIG. 8C is an exploded view of an exemplary array slide 1200 inaccordance with some embodiments. In FIG. 8C, the plurality of discretethrough-holes 1214 defined by the sheet layer 1212 of the firststructure 1210 are shown. FIG. 8C also illustrates a plurality ofprotrusions in the second structure 1220 that correspond to theplurality of discrete through-holes 1214 defined by the sheet layer1212.

Although the sheet layer 1212 is illustrated as having a width less thanthe width of the second structure 1220 and a length less than the lengthof the second structure 1220 in FIGS. 8A-8C, in some embodiments, thesheet layer 1212 has the same width and length as the second structure1220. Thus, the sheet layer 1212 may run from one end of the secondstructure to the opposite end of the second structure 1220.

Methods for Making the Array Slides

FIGS. 9A-9D are schematic diagrams illustrating selected steps formanufacturing an exemplary array slide 1200 in accordance with someembodiments.

FIG. 9A illustrates that the first structure 1210 is held in a firstmold component 1330 by vacuum suction. The vacuum suction pulls thefirst structure 1210 toward the first mold component 1330 so that thefirst structure 1210 remains flat through the molding process.Typically, the vacuum suction is applied over a plurality of locationson the first structure 1210. The vacuum suction typically leaves one ormore indentations on the surface of the first structure 1210 facing thefirst mold component 1330. In some embodiments, the first mold component1330 includes a plurality of vacuum holes (not shown).

In some embodiments, a plurality of pins 1342 coupled with the secondmold component 1340 are spring loaded so that the plurality of pins 1342are configured to apply force on the first structure 1210 toward thefirst mold component 1330 when the first mold component 1330 and thesecond mold component 1340 are assembled together.

In some embodiments, the bottom surface of the first structure 1210(e.g., the surface facing the second mold component 1340) is treated,typically before the first structure 1210 is held in the first moldcomponent 1330, to facilitate coupling with the second structure 1220.In some embodiments, the bottom surface of the first structure 1210 istreated to reduce the hydrophobicity (e.g., increase the surfacetension) of the first structure 1210. In some embodiments, the bottomsurface of the first structure 1210 is roughened to increate the contactarea with the second structure 1220.

In some embodiments, the first mold component 1330 has a flat surface ora portion of the surface that is flat facing the first structure 1210.In some embodiments, the surface of the first mold component 1330 hasprotrusions and/or indentations, the impact of which is described abovewith respect to FIGS. 5A-5C. For brevity, these descriptions are notrepeated herein.

FIG. 9B illustrates that the first mold component 1330 and the secondmold component 1340 are assembled, thereby forming a cavity inside, intowhich a heated plastic material is introduced for a molding process.

FIG. 9C illustrates that a heated plastic material is introduced intothe cavity. In some embodiments, the plastic material includespolycarbonates. In some embodiments, the plastic material includescyclic olefin polymer or copolymer or polystyrene. The heated plasticmaterial fills the cavity.

Once the heated plastic material is cooled, the plastic material formsthe second structure 1220. When the second structure 1220 is formed, thesecond structure 1220 is coupled with the first structure 1210 so as toform the array slide 1200.

FIG. 9D illustrates that the array slide 1200 is removed from the firstmold component 1330 and the second mold component 1340.

Note that the array slide 1200 removed from the first mold component1330 and the second mold component 1340 has pin marks corresponding tothe plurality of pins 1342 coupled with the second mold component 1340.When optical measurements (e.g., collection of optical images or opticalsignals) are performed through respective portions of the secondstructure 1220 corresponding to the plurality of discrete through-holesdefined in the first structure 1210, if the pin marks are located at therespective portions of the second structure 1220 corresponding to theplurality of discrete through-holes defined in the first structure 1210,the pin marks interfere optical measurements. Thus, to avoid theinterference by the pin marks, the plurality of pins 1342 are locatedoffset from the plurality of discrete through-holes defined in the firststructure 1210.

Although FIGS. 9A-9D illustrate forming the array slide 1200 by usingboth the vacuum suction and the plurality of pins 1342, in someembodiments, only one of the vacuum suction and the plurality of pins1342 is used. For example, the vacuum suction may be used without usingthe plurality of pins 1342. Alternatively, the plurality of pins 1342may be used without the vacuum suction.

Additional Features of Array Slides

FIG. 10A is a top-down view of an exemplary array slide 1400 inaccordance with some embodiments. The array slide 1400 has one or morecharacteristics of the array slide 1200 described above with respect toFIGS. 8A-8C. The descriptions of such characteristics are not repeatedfor brevity.

The array slide 1400 has a first structure 1410 and a second structure1420. The first structure 1410 includes a sheet layer 1412 and one ormore connectors 1416. In some embodiments, the one or more connectors1416 are integrated in the sheet layer 1412.

FIG. 10A also indicates a line B-B′ across the array slide 1400. Theline B-B′ corresponds to the cross-sectional view illustrated in FIG.10B.

FIG. 10B is a partial cross-sectional view of the exemplary array slide1400 in accordance with some embodiments. The partial cross-sectionalview shown in FIG. 10B has one or more characteristics of the partialcross-sectional view shown in FIG. 8B. The descriptions of suchcharacteristics are not repeated for brevity.

The first structure 1410 includes one or more connectors 1416. In someembodiments, at least one of the connectors 1416 is positioned so thatits top surface is aligned with the top surface of the sheet layer 1412.However, as explained below with respect to FIG. 11B, at least one ofthe connectors 1416 may be positioned that its top surface is positionedbelow the top surface of the second structure 1412 (e.g., the topsurface of the connectors 1416 is embedded in the second structure1420).

The one or more connectors 1416 serve multiple functions. For example,the one or more connectors 1416, in particular when the one or moreconnectors 1416 are embedded in the second structure 1420, prevents thepeeling of the first structure 1410 from the second structure 1420. Theone or more connectors 1416 also allow first structures for multiplearray slides to be held together in the molding cavity. This facilitatesthe manufacturing of multiple array slides.

FIG. 10C is a top-down view of exemplary array slides (1400-1 through1400-8) in accordance with some embodiments. The array slides (1400-1through 1400-8) shown in FIG. 10C can be formed in a single moldingprocess. For example, in some embodiments, instead of placing a singlefirst structure in a molding cavity as illustrated in FIGS. 9A-9D, anarray of first structures is placed in a molding cavity, and the moldingsteps (e.g., filling the cavity with heated plastic material and coolingthe plastic material to form second structures). After the array ofarray slides (1400-1 through 1400-8) is formed, the array slides may beseparated (e.g., by cutting the array along boundary lines between arrayslides).

FIG. 11A is a top-down view of an exemplary array slide 1500 inaccordance with some embodiments. The array slide 1500 has one or morecharacteristics of the array slides 1200 and 1400 described above withrespect to FIGS. 8A-8C and FIGS. 10A-10C. The descriptions of suchcharacteristics are not repeated for brevity.

The array slide 1500 has a first structure 1510 and a second structure1520. The first structure 1510 includes a sheet layer 1512 and one ormore connectors (not shown). The sheet layer 1512 defines a plurality ofdiscrete through-holes (1514-1 through 1514-8).

FIG. 11A also indicates a line C-C′ across the array slide 1500. Theline C-C′ corresponds to the cross-sectional view illustrated in FIG.11B.

FIG. 11B is a partial cross-sectional view of the exemplary array slide1500 in accordance with some embodiments. The partial cross-sectionalview shown in FIG. 11B has one or more characteristics of the partialcross-sectional view shown in FIG. 11B. The descriptions of suchcharacteristics are not repeated for brevity.

The first structure 1510 includes one or more connectors 1516. In FIG.11B, at least one of the connectors 1416 is positioned so that its topsurface is positioned below the top surface of the second structure 1520(e.g., the top surface of the connectors 1416 is embedded in the secondstructure 1520). This reduces the peeling (i.e., separation) of thefirst structure 1510 from the second structure 1520.

FIG. 11B also illustrates that one or more sides of the first structure1510 are angled. For example, the sides of the through-holes 1514-7 and1514-8 are angled. As shown in FIG. 11B, a cross-sectional view of thesheet layer 1512 includes a trapezoidal shape. As a result, the topsurface of the sheet layer 1512 has a smaller area than the bottomsurface of the sheet layer 1512. This further reduces the peeling (i.e.,separation) of the first structure 1510 from the second structure 1520.

Although FIG. 11B illustrates the angled sides of the first structure1510 have having straight lines, in some embodiments, the sides of thefirst structure 1510 have curves (e.g., concave or convex).

Although FIGS. 11A-11B illustrate embodiments that implement both theconnectors and the angled sides, it is possible to implement only one oftwo features. For example, as illustrated in FIGS. 10A-10C, theconnectors may be implemented without the implementing angled sides.Alternatively, the angled sides may be implemented without implementingthe connectors.

FIGS. 12A-12D are flow charts representing a method 700 of making anarray slide in accordance with some embodiments.

The method includes (702) providing a first structure in a mold (e.g.,FIG. 9A). The first structure includes a sheet layer with a plurality ofdiscrete through-holes (e.g., FIG. 8C).

In some embodiments, the sheet layer includes (704) at least 50% offluorocarbon by weight. In some embodiments, the sheet layer includes(706) at least 90% of fluorocarbon by weight. In some embodiments, thesheet layer includes (708) at least 95% of fluorocarbon by weight. Insome embodiments, the sheet layer includes (710) at least 99% offluorocarbon by weight.

In some embodiments, the sheet layer includes (712) at least 90% ofpolytetrafluoroethylene by weight. In some embodiments, the sheet layerincludes (714) at least 95% of polytetrafluoroethylene by weight. Insome embodiments, the sheet layer includes (716) at least 99% ofpolytetrafluoroethylene by weight.

In some embodiments, the method includes (718) pressing the firststructure against a first surface of a mold prior to providing theheated plastic material (e.g., FIGS. 9A-9B).

In some embodiments, pressing the first structure against the firstsurface of the mold includes (720) pressing the first surface of thesheet layer against the first surface of the mold with a plurality ofpins at least on the second surface of the sheet layer (e.g., FIG. 9B).

In some embodiments, the method includes (722) providing vacuum suctionon the first surface of the sheet layer (e.g., FIG. 9A).

The method includes (724) providing a heated plastic material into themold (e.g., FIG. 9C).

In some embodiments, the plastic material includes (726) polycarbonates.

In some embodiments, the plastic material includes (728) cyclic olefinpolymer or copolymer or polystyrene.

In some embodiments, the plastic material is (730) opticallytransparent. In some embodiments, the plastic material is opticallytransparent for a wavelength range selected from the group consistingof: 250-900 nm, 35-850 nm, 400-800 m, 450-800 nm, and 500-800 nm.

The method includes (732) cooling the plastic material to form a secondstructure so that the first structure and the second structure arecoupled (e.g., FIGS. 9C-9D).

In some embodiments, a base of the second structure is (734) opticallytransparent. A base of the second structure includes one or moreportions of the second structure located below the plurality of discretethrough-holes defined by the first structure. In some embodiments, thebase is optically transparent for a wavelength range selected from thegroup consisting of: 250-900 nm, 35-850 nm, 400-800 m, 450-800 nm, and500-800 nm.

At least a portion of a first surface of the sheet layer of the firststructure is exposed (736) from the second structure, and a secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the second structure (e.g., FIGS. 8B, 10B, and11B).

In some embodiments, a top portion of the sheet layer, including theexposed portion of the first surface of the sheet layer, includes (738)at least 95% of fluorocarbon by weight. In some embodiments, a topportion of the sheet layer, including the exposed portion of the firstsurface of the sheet layer, includes (740) at least 99% of fluorocarbonby weight.

In some embodiments, the top portion of the sheet layer is defined (742)by the exposed portion of the first surface and less than 1 μmthickness.

In some embodiments, the top portion of the sheet layer is defined (744)by the exposed portion of the first surface and less than 100 nmthickness.

In some embodiments, at least 90% of the exposed portion of the firstsurface is covered (746) by fluorocarbon. In some embodiments, at least95% of the exposed portion of the first surface is covered (748) byfluorocarbon. In some embodiments, at least 99% of the exposed portionof the first surface is covered (750) by fluorocarbon.

In some embodiments, at least 90% of the exposed portion of the firstsurface is covered (752) by polytetrafluoroethylene. In someembodiments, at least 95% of the exposed portion of the first surface iscovered (754) by polytetrafluoroethylene. In some embodiments, at least99% of the exposed portion of the first surface is covered (756) bypolytetrafluoroethylene.

In some embodiments, the exposed portion of the first surface ischaracterized (758) by advancing and receding contact angles, for aliquid selected from a group including water, ethanol, and isopropanol,that are similar to advancing and receding contact angles, for theselected liquid, on polytetrafluoroethylene.

In some embodiments, the second structure includes (760) a plurality ofholding locations. The method includes aligning the first structure andthe second structure so that the plurality of discrete through-holesdefined in the sheet layer of the first structure is offset from theplurality of holding locations in the second structure.

In some embodiments, the mold is configured (762) so that a top surfaceof the sheet layer of the first structure is aligned with a top surfaceof a base layer of the second structure (e.g., FIG. 5A).

In some embodiments, the mold is configured (764) so that a top surfaceof the sheet layer of the first structure is above a top surface of abase layer of the second structure (e.g., FIG. 5C). In some embodiments,the mold is configured (766) so that a top surface of the sheet layer ofthe first structure is below a top surface of a base layer of the secondstructure (e.g., FIG. 5B). In some embodiments, the first surface of themold has (768) one or more of: a plurality of indentations and aplurality of protrusions, corresponding to the plurality of discretethrough-holes defined in the sheet layer.

In some embodiments, at least a portion of the first surface of thesheet layer is embedded (770) in the second structure. For example, thesecond structure covers along a periphery of discrete through-holesdefined by the sheet layer over the first surface of the sheet layer. Insome embodiments, a plurality of portions of the first surface of thesheet layer is embedded in the second structure.

In some embodiments, the first structure includes (772) one or moreconnectors coupled to one or more sides of the sheet layer (e.g., FIGS.10A-10C and FIG. 11B). In some embodiments, the one or more connectorsare embedded (774) in the second structure (e.g., FIG. 11B).

In some embodiments, at least a portion of the sides of the sheet layeris angled (776) (e.g., FIG. 11B). In some embodiments, the sides, otherthan the inner walls of the discrete through-holes, of the sheet layerare angled. In some embodiments, an inner wall of at least one discretethrough-hole of the sheet layer is angled (778) (e.g., FIG. 11B).

In some embodiments, the second surface of the sheet layer has a largerarea than the first surface of the sheet layer (780) (e.g., FIG. 11B)

In some embodiments, the method includes (782) coating a portion of thesecond structure with oil. In some embodiments, the method includescoating (784) a portion of the first surface of the sheet layer of thefirst structure with the oil. In some embodiments, the oil is selected(786) from the group consisting of a mineral oil, a silicone oil, ahydrocarbon compound, a hydroperfluorocarbon compound and aperfluorocarbon compound.

Methods for Using the Array Slides

In some embodiments, a method for using an array slide includesproviding the array slide, and providing one or more biological and/orchemical samples for processing.

In some embodiments, a method for using an array slide includes placingthe array slide in a reservoir. The method includes storing a liquidmedium in the reservoir of the apparatus so that the first surface ofthe sheet layer is covered by the liquid medium, and dispensingrespective liquid droplets on respective locations on the base layer.The respective locations correspond to locations of the plurality ofdiscrete through-holes defined in the sheet layer, and the respectiveliquid droplets are immiscible with the liquid medium.

In some embodiments, a method includes processing a cell by placing aplurality of droplets on respective regions of the second structure thatare not covered by the first structure. Respective droplets includecells for processing. The method also includes adding one or morebiological and/or chemical reagents to the respective droplets.

Various aspects and characteristics of the methods of using the arrayplates described above are applicable to array slides (e.g., adding oneor more solutions to one or more liquid droplets of the respectiveliquid droplets, performing an immunoassay, and washing a respectiveliquid droplets), and vice versa. Because these aspects andcharacteristics are described above, they are not repeated herein.

It is well known to a person having ordinary skill in the art that arrayslides and plates can be used in many other biological and chemicalreactions. Therefore, such details and specific examples are omitted forbrevity.

The foregoing description, for purpose of explanation, has beendescribed with reference to specific embodiments. However, theillustrative discussions above are not intended to be exhaustive or tolimit the embodiments to the precise forms disclosed. Many modificationsand variations are possible in view of the above teachings. Theembodiments were chosen and described in order to best explain theprinciples of the invention and its practical applications, to therebyenable others skilled in the art to best utilize the invention andvarious embodiments with various modifications as are suited to theparticular use contemplated.

For example, in accordance with some embodiments, a device includes afirst structure including a sheet layer with a plurality of discretethrough-holes; and a second structure coupled to the first structure.The second structure includes a hydrophilic material. At least a portionof a first surface of the sheet layer of the first structure is exposedfrom the second structure. A top portion of the sheet layer, includingthe exposed portion of the first surface of the sheet layer, includesfluorocarbon. A second surface of the sheet layer, opposite to the firstsurface of the sheet layer, is embedded in the second structure. Thesecond structure extends at least partially into the plurality ofdiscrete through-holes of the first structure.

In accordance with some embodiments, a method includes providing a firststructure in a mold, the first structure including a sheet layer with aplurality of discrete through-holes. The method also includes providinga heated plastic material into the mold, and cooling the plasticmaterial to form a second structure so that the first structure and thesecond structure are coupled. At least a portion of a first surface ofthe sheet layer of the first structure is exposed from the secondstructure. A top portion of the sheet layer, including the exposedportion of the first surface of the sheet layer, includes fluorocarbon.The second structure includes a material of a higher surface tensionthan the top of the sheet layer (e.g., a hydrophilic material). A secondsurface of the sheet layer, opposite to the first surface of the sheetlayer, is embedded in the second structure. The second structure extendsat least partially into the plurality of discrete through-holes of thefirst structure.

What is claimed is:
 1. A device, comprising: a first structure includinga sheet layer with a plurality of discrete through-holes; and a secondstructure coupled to the first structure, wherein: at least a portion ofa first surface of the sheet layer of the first structure is exposedfrom the second structure; a top portion of the sheet layer, includingthe exposed portion of the first surface of the sheet layer, includesfluorocarbon; the second structure includes a material of a highersurface tension than the top of the sheet layer; a second surface of thesheet layer, opposite to the first surface of the sheet layer, isembedded in the second structure; and the second structure extends atleast partially into the plurality of discrete through-holes of thefirst structure.
 2. The device of claim 1, wherein the sheet layerincludes at least 96 discrete through-holes.
 3. The device of claim 1,wherein the top portion of the sheet layer includes at least 95% offluorocarbon by weight.
 4. The device of claim 1, wherein the topportion of the sheet layer includes at least 99% of fluorocarbon byweight.
 5. The device of claim 1, wherein the top portion of the sheetlayer is defined by the exposed portion of the first surface and lessthan 1 μm thickness.
 6. The device of claim 1, wherein the top portionof the sheet layer defined by to the exposed portion of the firstsurface and less than 100 nm thickness.
 7. The device of claim 1,wherein at least 90% of the exposed portion of the first surface iscovered by fluorocarbon.
 8. The device of claim 1, wherein at least 90%of the exposed portion of the first surface is covered bypolytetrafluoroethylene.
 9. The device of claim 1, wherein the sheetlayer includes at least 90% of polytetrafluoroethylene by weight. 10.The device of claim 1, wherein the second structure includespolycarbonates.
 11. The device of claim 1, wherein the second structureincludes cyclic olefin polymer or copolymer or polystyrene.
 12. Thedevice of claim 1, wherein a top surface of the sheet layer of the firststructure is aligned with a top surface of a base layer of the secondstructure.
 13. The device of claim 1, wherein a top surface of the sheetlayer of the first structure extends above a top surface of a base layerof the second structure.
 14. The device of claim 1, wherein a topsurface of the sheet layer of the first structure extends below a topsurface of a base layer of the second structure.
 15. The device of claim1, wherein the second structure has a first surface adjacent the firststructure, and the first surface of the second structure has one or moreof: a plurality of indentations and a plurality of protrusions, inregions corresponding to the plurality of discrete through-holes definedin the sheet layer when the second structure is coupled to the firststructure.
 16. The device of claim 1, wherein at least a portion of thefirst surface of the sheet layer is embedded in the second structure.17. The device of claim 1, wherein the second structure includes a baselayer and one or more vertical structures along a periphery of the baselayer, adjacent to a first surface of the base layer.
 18. The device ofclaim 1, wherein the one or more vertical structure, the base layer, andthe first structure define a reservoir.
 19. The device of claim 1,wherein the first structure includes a hydrophobic material.
 20. Amethod, comprising: providing a first structure in a mold, the firststructure including a sheet layer with a plurality of discretethrough-holes; providing a heated plastic material into the mold; andcooling the plastic material to form a second structure so that thefirst structure and the second structure are coupled, wherein: at leasta portion of a first surface of the sheet layer of the first structureis exposed from the second structure; a top portion of the sheet layer,including the exposed portion of the first surface of the sheet layer,includes fluorocarbon; the second structure includes a material of ahigher surface tension than the top of the sheet layer; a second surfaceof the sheet layer, opposite to the first surface of the sheet layer, isembedded in the second structure; and the second structure extends atleast partially into the plurality of discrete through-holes of thefirst structure.